Odisha has five chip projects worth over $4 billion

Chip-making in India is spreading east. Odisha already hosts two "firsts" from India's chip mission.

Semicon Weekly · 31 October 2026

In short

Odisha says five chip projects worth more than $4 billion are coming to the state.
Two of India's 12 approved chip mission projects are already in Odisha: the first compound semiconductor fab and the first advanced 3D glass chip packaging unit.
The state says work on them started within 6 to 8 months of approval.

Key numbers

5Chip projects in Odisha

$4 bn+Total value of the projects

2 of 12India's approved chip mission projects that are in Odisha

6–8 monthsFrom approval to start of work

In August 2025, the Union Cabinet approved two chip projects in Info Valley, Bhubaneswar, under the India Semiconductor Mission.
SiCSem, with UK partner Clas-SiC, is building India's first commercial compound semiconductor fab. It will make silicon carbide (SiC) chips for EVs, solar inverters, defence and data centres.
3D Glass Solutions (3DGS) is building an advanced packaging unit that uses glass layers to join many chips into one powerful module, for AI, defence and cars.
At the end of October 2026, Odisha said a total of five chip projects worth over $4 billion are now coming to the state.

SiCSem: 60,000 wafers and 96 million packaged chips.
3DGS: 69,600 glass panel substrates, 50 million assembled units and 13,200 3D chip modules.

SiC chips handle high power and heat, which EVs, chargers and solar power need.
Advanced packaging is how modern AI chips are built, by stacking and joining smaller chips.

Fabs and packaging plants hire process, equipment, test, quality and reliability engineers, not only designers.
Learn: semiconductor device basics, power electronics, and packaging terms (substrate, interposer, chiplet).
Students in eastern India may find chip jobs closer to home.

Chip-making is no longer only in Gujarat and Karnataka; more states are joining.
SiC and glass packaging are new technologies where India can start early.

Compound semiconductor: a chip material made of two or more elements, like silicon carbide (SiC), instead of only silicon.
Packaging: putting a bare chip into a protective case and connecting it to the outside world.
3D heterogeneous integration: stacking and joining different chips into one module.