Chip group ISIG says India is next big place for packaging
At its first India summit, the global chip group said AI has made packaging important again.
In short
- The International Semiconductor Industry Group (ISIG) is holding its first India executive summit in New Delhi.
- ISIG's CEO Salah Nasri said chip packaging is important again because of AI, and India is the next country to grow in it.
- ISIG India chapter head Santosh Kumar said India has a big chance in packaging, testing (OSAT) and power chips.
Key numbers
1stISIG executive summit in India
New DelhiSummit city
3Big chances for India: packaging, OSAT, power chips
What happened
- ISIG, a global chip industry group, held its first India executive summit in New Delhi.
- CEO Salah Nasri said AI chips have made packaging important again, and India is the next country to grow in it.
- Santosh Kumar, head of ISIG's India chapter, said India has a big chance in packaging, testing and power chips.
Why it matters
Why this is useful
- AI chips are built by joining many smaller chips inside one advanced package.
- Packaging and testing plants can be built faster than full chip factories.
Why it is good for freshers
- India's new packaging and testing plants will need many engineers, so packaging, testing and power device skills are smart areas to learn.
- Learn: chiplets, interposers, wire bonding, flip-chip and test basics.
- Mechanical, materials and ECE graduates all fit packaging roles.
Why it is good for India
- Packaging and testing is where India's chip plants are starting first.
- Power chips (SiC, GaN) are needed for EVs and solar, both growing in India.
Fresher jobs related to this story
Words in this story
- OSAT: Outsourced Semiconductor Assembly and Test, companies that package and test chips.
- Chiplet: a small chip that is joined with others to build one big chip.